The Choice of China LED Manufacturer For Package
The LED package is in a discrete device packaging technique based on the development and evolution of, but there is considerable specificity. In general, discrete components of the core tube are sealed in a package body package, and it is the role of the main protective tube core and completes the electrical interconnect. While the LED package chose by China led manufacturer is complete the electrical output signal, protection tube core work, output: visible light function, both the electrical parameters, the light design parameters and technical requirements, not simply be discrete device packaging for LED.
The Core of LED Tube Lighting
The core of LED light emitting portion is composed of P type and N type semiconductor tube core which is injected into the PN nodes of the minority and majority carrier compound, emit visible light, ultraviolet light or near infrared light. But PN junction region emitted photons is non-directional, i.e. each direction emission have the same probability, therefore, not all the light tube core can be released, it mainly depends on the quality of semiconductor materials, tube core structure and shape, internal structure and encapsulation materials, application requirements and improve LED internal, external quantum efficiency. Conventional F 5mm type led tube lighting package is the side length 0.25mm square tube core bonded or sintered in a lead frame, the anode of a die through a spherical point of contact with the wire, bonding to inner lead and a pin connected, through a reflective cup and cathode lead frame pins connected to another, then the top with epoxy resin encapsulation. Reflection cup is the role of the collection tube core side, the interface of light, to the expectation direction angle within the launch.
 The General LED Light
In general, the LED light emitting wavelength with temperature will change for the 0.2-0.3nm / C, spectral width increases, effect of color brightness. In addition, when the forward current flows through the PN node, the node area heating loss temperature rise, at near room temperature, temperature of each increased by 1 ?, LED luminous intensity will be reduced about 1%, package heat sink; maintain the color purity and intensity is very important, the reduction of the driving current approaches, reduces junction temperature, most of the LED drive current limit is around 20mA.However, LED light output varies with the current increasing, at present, a lot of power LED driving current can reach 70mA, 100mA or even 1A level, need to improve packaging structure, the new LED package design and low thermal resistance encapsulation structure and technology, improved thermal characteristics. For example, using a large area of flip chip structure, selection of good thermal conductivity of silver colloid, increase the metal stent surface area, solder bumps in the silicon carrier mounted directly on the heat sink for method.
This article come from:http://www.chinahotelsupply.com.cn/index.php/led-encapsulation-technology.htm
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