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Posted: May 21st, 2012 Applied Nanotech Unveils THERCOBOND Family of HighlyThermally-Conductive Bonding Materials ( Nanowerk News ) Applied Nanotech Holdings, Inc., a global leader innanotechnology, is pleased to announce that it has unveiled a newfamily of highly thermally-conductive bonding and printed materialscalled THERCOBOND™ for power electronics and photonicsapplications. THERCOBOND™ materials are specially designed for powerelectronic device packaging and dielectric coating, with an optimalcombination of thermal conductivity, thermal diffusivity, thermalexpansion, dielectric and insulating properties, wettability, andprintability. "The implementation of new thermal interface composites with asignificantly higher level of heat dissipation performance iscritical for the extreme requirements of power electronic devicestoday" said Dr. Nan (David) Jiang, Director of the ThermalManagement Division at Applied Nanotech, Inc. "The scope ofindustrial and commercial applications for THERCOBOND™materials is immense, starting with electronic packaging, powerLEDs, and PCB assembly, just to name a few." THERCOBOND™ materials can easily be applied on varioussubstrates by conventional screen printing, drawdown, and eveninkjet and other printing approaches to form thermally conductivedielectric layers for printed circuit board (PCB) applications aswell as other electronic packaging needs. The first two products in the THERCOBOND™ family arepolymer-based (DTC-P) and ceramic-based (DTC-C). DTC-P is a line of thermally conductive, electrically insulatingmaterials that are based on dielectric polymers modified tomaximize thermal conductivity with excellent adhesion andwettability to metals, semiconductors, and graphitic substrates(e.g. CarbAlTM). DTC-P is one-part bonding material and has aworking temperature up to 300 oC. DTC-C is a line of thermally conductive, electrically insulatingmaterials that are based on dielectric ceramics modified tomaximize thermal conductivity with excellent adhesion andwettability to semiconductors, and graphitic substrates (e.g.CarbAlTM). DTC-C is one-part bonding material with a low CTE ( 7 ppm/K after curing), and highly heat resistive with a workingtemperature up to 400 oC. "With the global market for thermal interface materials projectedto be over $600 million by the year 2016, the potential market forTHERCOBOND™ materials is very large," said Doug Baker, CEO ofApplied Nanotech Holdings, Inc. "The THERCOBOND™ family ofproducts now joins our award-winning thermal management materialCarbAlTM and our ultra-strong adhesive CNTstixTM in our growinglist of superior performance products based on our nanotechnologyinnovations. We are well on the way to achieving ourcommercialization and revenue goals we set for ourselves thisyear." Applied Nanotech Holdings, Inc. Applied Nanotech Holdings, Inc. is a global nanotechnology leader,focused on solving problems at the molecular level, andcommercializing the results of its research. Its team of PhD-levelscientists and engineers work with companies and otherorganizations to solve technical impasses and create innovationsthat will create a competitive advantage. The business model is tosell products and license patents and technology to partners thatwill manufacture and distribute products using the technology.Applied Nanotech has over 300 patents or patents pending. AppliedNanotech's website is . We are high quality suppliers, our products such as Shoring Frames , Modular Container House for oversee buyer. To know more, please visits Ratchet Wrench .
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