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2015 onwards, the foundry industry in the 16/14 nanometer competition will become more intense! Barclays Capital Securities Chocobo's pointed out that despite TSMC 28/20 nm leading position is still difficult to shake, but with Intel's 14 nanometer production capacity from the Ming (2014) opened the second half, Apple and Altera expects the second half of 2015 onwards, will be part of 14 nm FinFET under orders to Intel. TSMC Ming (11) days will be held at the foreign chairman Morris Chang can hope for the latest 14-nanometer manufacturing process to make the latest description of the competitive situation, in order to reduce market concerns. According to Barclays Capital Securities estimates that Apple from 2014 onwards will place among the top five customers of TSMC, the proportion will reach 6 percent of its revenue, TSMC future 14/16 nanometer process much Apple can win orders, will affect both dominance can be sustained long. International institutional investors recently in semiconductor Hutch for "sell TSMC, buy Intel" pairing transaction (pair trade) strategy, resulting in TSMC's share price correction correction, Intel shares rose nearly 1 year is different from the semiconductor Hutch stock price fluctuation trend. Barclays Capital Securities analyst Lu, chief Asia-Pacific semiconductor lines of that TSMC, Samsung, Intel and other high-end semiconductor manufacturing process three male competition became more intense from 2015 onwards. Among them, TSMC from the first half of 2015 began shipping 16 nm FinFET process for Xilinx, Qualcomm, Apple, MediaTek; For Samsung places 14 nm FinFET processes meet internal smart phone chips strong demand; Intel's 14-nanometer process in 2014 in the second After six months out from the second half of 2015, won the part of Apple and Altera FinFET orders. Land-line assessment, Intel 14-nanometer process has higher than average yield of about 20 percent, and smaller die size and other advantages, but TSMC wafer cost about 50% higher, as well as IC design conflict of interest between customers problem, the advantages and disadvantages between the two will cancel each other out. Overall, that the future of the land-line 14/16 nm FinFET foundry field can win the key factors include the following five: one, no conflicts of interest with customers; Second, the production yield carve out during the performance; three customers Process IP content will affect the strength of the design results; four, memory consolidation eyebrow feet (know-how); volume of customer orders and product content will affect the capacity utilization. Chocobo's view, these are the next two to three years of competition, the effect of Apple's switch to a single blessing, TSMC since the first quarter of 2014, or can be both 28-nanometer process technology leadership extends all the way to 20 nm, remain dominant position. Apple laptop battery
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